Fe doped LT Wafers
Parameter
Specification
Material
LiTaO3 wafers（White or Black &Fe doped）
Diameter
3inch/4inch/6inch
Diameter Tolerance
±0.03mm
Curie Temp
603±2℃
Cutting Angle
X/Y/Z/X112Y/Y36/Y42/Y48/etc
Tol(±)
<0.20 mm
Thickness
0.18 ~ 0.5mm or more
Primary Flat
22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)
<1µm
TTV
<3µm
BOW
-30
WARP
<40µm
PLTV(<0.5um)
≥95%(5mm*5mm)
Orientation Flat
All available
Surface Type
Single Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra
<0.5nm
Back Side Criteria
General is 0.2-0.5µm or as customized
Edge Criteria
R=0.2mm or Bullnose
Fe doped
Fe doped for saw grade LN< wafers
Wafer Surface Criteria
Transmissivity general:5.9x10-11-10 at 25℃
Contamination None
Particles @>0.3 µm ≤30
Scratch , Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing
25pcs per box
Optical Grade Lithium Tantalate Wafers
Parameter
Specification
Material
LiTaO3 wafers（White or Black）
Diameter
2inch/3inch/4inch
Diameter Tolerance
±0.03mm
Curie Temp
603±2℃
Cutting Angle
X/Y/Z etc.
Tol(±)
<0.20 mm
Thickness
0.18 ~ 0.5mm or more
Primary Flat
16mm/22mm /32mm
TTV
<3µm
BOW
-30
WARP
<40µm
Surface Type
Single Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra
<0.5nm
Back Side Criteria
General is 0.2-0.5µm or as customized
Edge Criteria
R=0.2mm or Bullnose
Optical doped
Zn/MgO etc.
Wafer Surface Criteria
Contamination None
Particles @>0.3 µm ≤30
Scratch , Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing
25pcs per box
SAW Grade Lithium Tantalate Wafers
Parameter
Specification
Material
LiTaO3 wafers
Diameter
3inch/4inch/6inch
Diameter Tolerance
±0.03mm
Curie Temp
603±2℃
Cutting Angle
X/Y/Z/X112Y/Y36/Y42/Y48/etc.
Tol(±)
<0.20 mm
Thickness
0.18 ~ 0.5mm or more
Primary Flat
22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)
<1µm
TTV
<3µm
BOW
-30
WARP
<40µm
PLTV(<0.5um)
≥95%(5mm*5mm)
Orientation Flat
All available
Surface Type
Single Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra
<0.5nm
Back Side Criteria
General is 0.2-0.5µm or as customized
Edge Criteria
R=0.2mm or Bullnose
Wafer Surface Criteria
Transmissivity general:5.9x10-11-10 at 25℃
Contamination None
Particles @>0.3 µm ≤30
Scratch , Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing
25pcs per box